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BCR

BCR

项目介绍:

FEATURES

• Wire bondable

• Only one wire bond required

• Small size: 0.020 inches square

• Resistance range: 10Ωto 1 MΩ

• Oxidized silicon substrate for good power dissipation

• Resistor material: Tantalum nitride, self-passivating

• Moisture resistant

• Case size: 0202

 

APPLICATIONS

Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting the resistor to the bottom of the chip.)

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