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CDHV

CDHV

项目介绍:

FEATURES

• High voltage up to 3000 V

• Typical resistance ratios of 250:1, 500:1, etc; maximum resistance ratio of 800:1

• Flow solderable

• Tape and reel packaging available

• Termination style: 3-sided wraparound termination or single termination flip chip available

• Suitable for solderable, epoxy bondable, or wire bondable applications

• Termination material: solder-coated nickel barrier or solder coated non-magnetic terminations standard; gold, palladium silver, platinum gold, platinum silver or platinum palladium gold terminations available

• Multiple styles, termination materials and configurations, allow wide design flexibility

• Epoxy bondable or wire bondable non-magnetic terminations available

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