FEATURES
• High voltage up to 3000 V
• Typical resistance ratios of 250:1, 500:1, etc; maximum resistance ratio of 800:1
• Flow solderable
• Tape and reel packaging available
• Termination style: 3-sided wraparound termination or single termination flip chip available
• Suitable for solderable, epoxy bondable, or wire bondable applications
• Termination material: solder-coated nickel barrier or solder coated non-magnetic terminations standard; gold, palladium silver, platinum gold, platinum silver or platinum palladium gold terminations available
• Multiple styles, termination materials and configurations, allow wide design flexibility
• Epoxy bondable or wire bondable non-magnetic terminations available