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项目介绍:

• Style FC - Flip Chip version for surface mount applications.

Style WB - Wire Bond version for hybrid applications with metallized back surface for solder down heat sinking of the chip, includes bondable termination pads to receive aluminum wire bonds.

• Thermal resistance is provided to optimize high power designs when utilizing higher thermal conductivity circuit board substrates such as IMS or Alumina.

• Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%, and 0.10 ohm at ±1%.

• Low inductance provides excellent high frequency and pulse response.

• High pulse handling and overload capability.

• Best choice for switching power supplies, motor speed controls, and high current sensing applications.

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